PHASE DIAGRAMS AS TOOLS FOR ADVANCED MATERIALS DESIGN: APPLICATIONS TO NON-FERROUS ALLOYS
DIAGRAMAS DE FASES COMO FERRAMENTA NO PROJETO DE MATERIAIS AVANÇADOS- APLICACOES A LIGAS NÃO-FERROSAS
Ohnuma, Ikuo; Ishida, Kiyohito
http://dx.doi.org/10.4322/2176-1523.1085
Tecnol. Metal. Mater. Min., vol.13, n1, p.46-63, 2016
Abstract
It is recognized that phase diagrams and a thermodynamic database constructed by the CALPHAD (Calculation of Phase Diagrams) approach play an important role in alloy design and materials development. In this paper, recent progress on the thermodynamic database for micro-solders and Cu-base alloys, which is useful for the development of Pb-free solders and predictions of interfacial phenomena between solders and the Cu substrate in electronic packaging technology, is presented. In addition, typical examples of the application of phase diagrams are presented to facilitate the development of shape memory alloys, Co-Cr base magnetic recording media, ferromagnetic Heusler alloys and Co base superalloys.
Keywords
CALPHAD, Pb-free solders, Co-Cr magnetic recording media, Co based superalloys, Alloy design, Phase diagrams
Resumo
Já é bem aceito que diagramas de fases e um banco de dados termodinamicos construídos através do enfoque CALPHAD (Calculation of Phase Diagrams) tem um papel importante no projeto de ligas e no desenvolvimento de materiais. Neste artigo, são apresentados os recentes progressos nos bancos de dados para micro-soldas e ligas a base de cobre, que são úteis para o desenvolvimento de soldas isentas de Pb e para as previsões dos fenômenos interfaciais entre estas soldas e os substratos de Cu na tecnologia de montagem de componentes eletrônicos. Adicionalmente, exemplos típicos da aplicação de diagramas de fases no auxilio do desenvolvimento de ligas de memória de forma, ligas Co-Cr para mídia de gravação magnética de dados, ligas ferromagnéticas do tipo Heusler e superligas a base de Co são apresentados e discutidos.
Palavras-chave
CALPHAD, Ligas para soldagem isentas de Pb, Ligas para mídia de gravação magnética Co-Cr, Superligas a base de Co, Projeto de ligas, Diagramas de fases.
Referências
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3 Saunders N, Miodownik AP. CALPHAD. Lausanne: Pergamon; 1998.
4 Sundman B, Jansson B, Andersson J-O. The Thermo-Calc databank system. Calphad. 1985;9(2):153-190. http://dx.doi.org/10.1016/0364-5916(85)90021-5.
5 Eriksson G, Hack K. Calculation of phase equilibria in multicomponent alloy systems using a specially adapted version of the program ‘SOLGASMIX’. Calphad. 1984;8(1):15-24. http://dx.doi.org/10.1016/0364-5916(84)90025-7.
6 Bale CW, Chartrand P, Degterov SA, Eriksson G, Hack K, Ben Mahfoud R, et al. FactSage thermochemical software and databases. Calphad. 2002;26(2):189-228. http://dx.doi.org/10.1016/S0364-5916(02)00035-4.
7 Chen SL, Daniel S, Zhang F, Chang YA, Oates WA, Schmid-Fetzer R. On the calculation of multicomponent stable phase diagrams. Journal of Phase Equilibria. 2001;22(4):373-378. http://dx.doi.org/10.1361/105497101770332910.
8 Ohnuma I, Liu XJ, Ohtani H, Ishida K. Thermodynamic database for phase diagrams in micro-soldering alloys. Journal of Electronic Materials. 1999;28(11):1163. http://dx.doi.org/10.1007/s11664-999-0152-5.
9 Ohnuma I, Liu XJ, Ohtani H, Ishida K. In: Thermodynamic database for micro-soldering alloys. Grassie K, Tenckhoff E, Wegner G, Haubell J, Hanselka H, editors. Weinheim: Wiley-VCH; 2000. 69 p.
10 Ohnuma I, Liu XJ, Kainuma R, Ohtani H, Chen SL, Chang YA, Ishida K. Development of thermodynamic tool “ADAMIS/Pandat” and its application in design of micro-soldering materials. In: Proceedings of Annual Congress of ABM; 2003. p. 897-903.
11 Liu XJ, Ohnuma I, Wang CP, Jiang M, Kainuma R, Ishida K, et al. Thermodynamic database on microsolders and copper-based alloy systems. Journal of Electronic Materials. 2003;32(11):1265-1272. http://dx.doi.org/10.1007/s11664-003-0021-6.
12 Wang CP, Liu XJ, Jiang M, Ohnuma I, Kainuma R, Ishida K. Thermodynamic database of the phase diagrams in copper base alloy systems. Journal of Physics and Chemistry of Solids. 2005;66(2-4):256-260. http://dx.doi.org/10.1016/j.jpcs.2004.08.037.
13 Vianco PT, Frear DR. Issues in the replacement of lead-bearing solders. Journal of The Minerals, Metals & Materials Society. 1993;45(7):14-19. http://dx.doi.org/10.1007/BF03222374.
14 Liu XJ, Oikawa K, Ohnuma I, Kainuma R, Ishida K. The use of phase diagrams and thermodynamic databases for electronic materials. JOM. 2003;55(12):53-59. http://dx.doi.org/10.1007/s11837-003-0012-3.
15 Wang CP, Liu XJ, Ohnuma I, Kainuma R, Ishida K. Formation of immiscible alloy powders with egg-type microstructure. Science. 2002;297(5583):990-993. http://dx.doi.org/10.1126/science.1073050. PMid:12169728.
16 Zhao JZ, He J, Hu ZQ, Ratke L. Microstructure evolution in immiscible alloys during rapid directional solidification. Zeitschrift fur Metallkunde. 2004;95(5):362-368. http://dx.doi.org/10.3139/146.017967.
17 Wu M, Ludwig A, Pelzer M, Postl U. On the Impact of Macroscopic Phase Separation on Solidification Microstructures. Advanced Engineering Materials. 2005;7(9):846-851. http://dx.doi.org/10.1002/adem.200500098.
18 He J, Zhao JZ, Ratke L. Solidification microstructure and dynamics of metastable phase transformation in undercooled liquid Cu–Fe alloys. Acta Materialia. 2006;54(7):1749-1757. http://dx.doi.org/10.1016/j.actamat.2005.12.023.
19 Kaptay G. Classification and general derivation of interfacial forces, acting on phases, situated in the bulk, or at the interface of other phases. Journal of Materials Science. 2005;40:2125.
20 Wang CP, Liu XJ, Kainuma R, Takaku Y, Ohnuma I, Ishida K. Formation of core-type macroscopic morphologies in Cu-Fe base alloys with liquid miscibility gap. Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science. 2004;35(4):1243-1253. http://dx.doi.org/10.1007/s11661-004-0298-y.
21 Takaku Y, Ohnuma I, Kainuma R, Yamada Y, Yagi Y, Nishibe Y, et al. Development of Bi-base high-temperature Pb-free solders with second-phase dispersion: thermodynamic calculation, microstructure, and interfacial reaction. Journal of Electronic Materials. 2006;35(11):1926-1932. http://dx.doi.org/10.1007/s11664-006-0295-6.
22 Yamada Y, Takaku Y, Yagi Y, Nakagawa I, Atsumi T, Shirai M, et al. Pb-free high temperature solders for power device packaging. Microelectronics and Reliability. 2006;46(9-11):1932-1937. http://dx.doi.org/10.1016/j.microrel.2006.07.083.
23 Yamada Y, Takaku Y, Yagi Y, Nakagawa I, Atsumi T, Shirai M, et al. Reliability of wire-bonding and solder joint for high temperature operation of power semiconductor device. Microelectronics and Reliability. 2007;47(12):2147-2151. http://dx.doi.org/10.1016/j.microrel.2007.07.102.
24 Ohnuma I, Saegusa T, Takaku Y, Wang CP, Liu XJ, Kainuma R, et al. Microstructural Evolution of Alloy Powder for Electronic Materials with Liquid Miscibility Gap. Journal of Electronic Materials. 2009;38(1):2-9. http://dx.doi.org/10.1007/s11664-008-0537-x.
25 Miyamoto T, Nagasako M, Kainuma R. Phase equilibria in the Ni-Mn-In alloy system. Journal of Alloys and Compounds. 2013;549:57-63. http://dx.doi.org/10.1016/j.jallcom.2012.08.128.
26 Tadaki T. Cu-based shape memory alloys. In: Otsuka K, Wayman CM, editors. Shape memory materials. Cambridge: Cambridge University Press; 1998. p. 97.
27 Kainuma R, Takahashi S, Ishida K. Thermoelastic martensite and shape memory effect in ductile Cu-Al-Mn alloys. Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science. 1996;27(8):2187-2195. http://dx.doi.org/10.1007/BF02651873.
28 Koster W, Godecke T. Das Dreistoffsystem Kupfer-Mangan-Aluminium. Zeitschrift fur Metallkunde. 1966;57:889. Tecnol. Metal. Mater. Miner., São Paulo, v. 13, n. 1, p. 46-63, jan./mar. 2016
29 Kainuma R, Satoh N, Liu XJ, Ohnuma I, Ishida K. Phase equilibria and Heusler phase stability in the Cu-rich portion of the Cu–Al–Mn system. Journal of Alloys and Compounds. 1998;266(1-2):191-200. http://dx.doi.org/10.1016/S0925-8388(97)00425-8.
30 Sutou Y, Omori T, Kainuma R, Ishida K, Yamauchi K. Development of Cu-Al-Mn-based shape memory alloys with enhanced ductility. Materia. 2003;42(11):813-821. http://dx.doi.org/10.2320/materia.42.813.
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