PRINTED CIRCUIT BOARD RECYCLING: PHYSICOCHEMICAL AND ECONOMIC ANALYSIS OF METALS
Marcos Paulo Kohler Caldas, Monica Maria Jiménez Correa, Flávia Paulucci Cianga Silvas, Viviane Tavares de Moraes, Jorge Alberto Soares Tenório, Denise Crocce Romano Espinosa
Abstract
This study aims to present the characterization of five different types of printed circuit boards (PCBs) for use in future recycling processes. PCBs used: motherboards, lead free motherboards, video cards, memory and printer cards. The comminution of the circuit boards was performed using blade mills and hammer mills with 9mm and 6mm meshes, respectively. Throughout the physical processing, analysis was made with stereoscopic optics to ensure that the correct materials had been released. The pre-magnetic separation parts were given a granulometric classification followed by acid digestion and loss on ignition tests. The composition of the PCBs studied varied from one board to another, with the metallic fraction being the main constituent of lead free motherboards, video cards and printer PCBs, while the motherboard and memory cards contain a greater volume of polymeric and ceramic material constituents respectively. Three samples showed similar behavior in granulometric distribution with a tendency of material accumulation in the sieves with wider meshes and, in two of them the highest percentage of material was retained by those with smaller screens. Cu was the metal found in the greatest concentration. Silver, gold and copper were the metals with the highest value percentages.
Keywords
Referências
1 Schluep M, Hagelüken C, Kuehr R, Magalini F, Maurer C, Meskers C, et al. Recycling: from e–waste to resources. Berlin: United Nations Environment Programme, United Nations University; 2009. p. 95.
2 Robinson BH. E-waste: an assessment of global 534 production and environmental impacts. The Science of the Total Environment. 2009;408:183-191.
3 European Parliament. The Council of the European Union. Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE). Official Journal of the European Union. 2003 [cited 2010 Nov 29]. Available at: https://eur-lex.europa.eu/resource. html?uri=cellar:ac89e64f-a4a5-4c13-8d96-1fd1d6bcaa49.0004.02/DOC_1&format=PDF
4 European Parliament. The Council of the European Union. Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). Official Journal of the European Union. 2003.
5 Aizawa, H., Yoshida, H., & Sakai, S. Current results and future perspectives for Japanese recycling of home electrical appliances. Resources, Conservation and Recycling. 2008;52:1399-1410.
6 Havlik T, Orac D, Berwanger M, Maul A. The effect of mechanical–physical pretreatment on hydrometallurgical extraction of copper and tin in residue from printed circuit boards from used consumer equipment. Minerals Engineering. 2014;65:163-171.
7 Streicher-Porte M, Widmer R, Jain A, Bader HP, Scheidegger R, Kytzia S. Key drivers of the e-waste recycling system: assessing and modelling e-wast processing in the informal sector in Delhi. Environmental Impact Assessment Review. 2005;25:472-491.
8 Mecucci A, Scott K. Leaching and electrochemical recovery of copper, lead and tin from scrap printed circuit boards. Journal of Chemical Technology and Biotechnology (Oxford, Oxfordshire). 2002;77:449-457.
9 Davenport WG, King M, Schlesinger M, Biswas AK. Extractive metallurgy of copper. London: Pergamon; 2002.
10 Yamane LH, Espinosa DCR, Tenório, JAS. Lixiviação bacteriana de sucata eletrônica: influência dos parâmetros de processo. Tecnologia em Metalurgia, Materiais e Mineração. 2013;10(1):50-56.
11 Petter PMH, Veit HM, Bernardes AM. Evaluation of gold and silver leaching from printed circuit board of cellphones. Waste Management (New York, N.Y.). 2014;34:475-482.
12 Duan CL, Diao ZJ, Zhao YM, Huang W. Liberation of valuable materials in waste printed circuit boards by highvoltage electrical pulses. Minerals Engineering. 2015;70:170-177.
13 Ogunniyi IO, Vermaak MKG. Investigation of froth flotation for beneficiation of printed circuit board comminution fines. Minerals Engineering. 2009;22:378-385.
14 Tuncuk A, Stazi V, Akcil A, Yazici EY, Deveci H. Aqueous metal recovery techniques from e-scrap: Hydrometallurgy in recycling. Minerals Engineering. 2012;25:28-37.
15 Guo C, Wang H, Liang W, Fu J, Yi X. Liberation characteristic and physical separation of printed circuit board (PCB). Waste Management (New York, N.Y.). 2011;31(9-10):2161-2166.
16 Ladou J. Printed circuit board industry. International Journal of Hygiene and Environmental Health, 2006;209(3):211- 219.
17 Goosey M, Kellner R. Recycling technologies for the treatment of end of life printed circuit boards (PCBs). Circuit World. 2003;29(3):33-37.
18 Koyanaka S, Endoh S, Ohya H. Effect of impact velocity control on selective grinding of waste printed circuit boards. Advanced Powder Technology. 2006;17(1):113-126.
19 Tavares V. Caracterização e processamento de telas de cristal líquido visando a reciclagem [tese]. São Paulo: Universidade de São Paulo; 2006.
20 Moraes VT. Recuperação de metais a partir do processamento mecânico e hidrometalurgico de placas de circuito impressos de celulares obsoletos [tese]. São Paulo: Universidade de São Paulo; 2011.
21 Yamane LH. Recuperação de metais de placas de circuito impresso de computadores obsoletos através de processo biohidrometalúrgico [tese]. São Paulo: Universidade de São Paulo; 2012.
22 Yamane LH, de Moraes VT, Espinosa DCR, Tenório JAS. Recycling of WEEE: characterization of spent printed circuit boards from mobile phones and computers. Waste Management (New York, N.Y.). 2011;31:2553-2558.
23 Jianzhi L, Shrivastava P, Zong G, Hong-Chao Z. Printed circuit board recycling: a state-of-the-art survey. Electronics Packaging Manufacturing, IEEE Transactions on. 2004;27(1):33-42.
24 Park YJ, Fray DJ. Recovery of high purity precious metals from printed circuit boards. Journal of Hazardous Materials. 2009;164:1152-1158.
25 Veit HM, Bernardes AM, Ferreira JZ, Tenório JAS, Malfatti CF. Recovery of copper from printed circuit boards scraps by mechanical processing and electrometallurgy. Journal of Hazardous Materials. 2006;137(3):1704-1709.
26 Associação Brasileira de Circuitos Impressos – ABRACI. Orientações para fornecimento de componentes para montagem de placas de circuitos impressos. São Paulo: ABRACI; 2010 [cited 2010 Nov 29]. Available at: http://www.abraci.org.br/arquivos/MANUAL_MONTAGEM.PDF
27 Shinkuma T, Huong NTM. The flow of e-waste material in the Asian region and a reconsideration of international trade policies on e-waste. Environmental Impact Assessment Review. 2009;29:25-31.
28 Veit HM. Emprego do processamento mecânico na reciclagem de placas de circuio impresso. Porto Alegre: Universidade Federal do Rio Grande do Sul; 2001.
29 Ilyas S, Anwar MA, Niazi SB, Afzal Ghauri M. Bioleaching of metals from electronic scrap by moderately thermophilic acidophilic bacteria. Hydrometallurgy. 2007;88:180-188.
30 Darby L, Obara L. Household recycling behaviour and attitudes towards the disposal of small electrical and electronic equipment. Resources, Conservation and Recycling. 2005;44(1):17-35.
31 Tripathi A, Kumar M, Sau DC, Agrawal A, Chakravarty S. Leaching of gold from the waste mobile phone printed circuit boards (PCBs) with ammonium thiosulphate. International Journal of Metallurgical Engineering. 2012;1:17-21.
32 Ha VH, Lee J, Huynh TH, Jeong J, Pandey BD. Optimizing the thiosulphate leaching of gold from printed circuit boards of discarded mobile phone. Hydrometallurgy. 2014;149:118-126.
33 Jing-ying L, Xiu-li X, Wen-quan L. Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones. Waste Management (New York, N.Y.). 2012;32:1209-1212.
34 Chi TD, Lee J, Pandey BD, Yoo K, Jeong J. Bioleaching of gold and copper from waste mobile phone PCBs by using a cyanogenic bacterium. Minerals Engineering. 2011;24:1219-1222.
35 Institute for Scrap Recycling Industries Inc – ISRI. U.S. based scrap recycling industry. Economic impact study of ISRI. Washington: ISRI; 2015 [cited 2018 Apr 6]. Available at: http://www.isri.org/docs/default-source/recycling-analysis- (reports-studies)/economic-impact-study-u-s-based-scrap-recycling-industry-2015.pdf?sfvrsn=10
36 Institute for Scrap Recycling Industries Inc – ISRI. The ISRI scrap yearbook. Washington: ISRI; 2014 [cited 2018 Apr 6]. Available at: http://www.isri.org/docs/default-source/commodities/2014-scrap-yearbook.pdf
37 Sarath P, Bonda S, Mohanty S, Nayak SK. Mobile phone waste management and recycling: views and trends. Waste Management (New York, N.Y.). 2015;46:536-545.
38 LBMA. Gold and silver price. London: LBMA; 2018 [cited 2018 Apr 6]. Available at: http://www.lbma.org.uk/pricingand-statistics
39 The London Metal Exchange. Metals price. London: LME; 2018 [cited 2018 Apr 6]. Available at: http://www.lme. com/
40 Sohali J, Muniyandi SK, Mohamad SS. A review on printed circuit board recycling technology. Journal of Emerging Trends in Engineering and Applied Sciences. 2012;3(1):12-18.
41 Tuncuk A, Stazi V, Akcil A, Yazici EY, Deveci H. Aqueous metal recovery techniques from e-scrap: hydrometallurgy in recycling. Minerals Engineering. 2012;25:28-37.
42 Hagelüken C. Improving metal returns and eco-efficiency in electronics recycling – a holistic approach for interface optimisation between pre-processing and integrated metals smelting and refining. In: Proceedings of the 2006 IEEE International Symposium on Electronics & the Environment; 2006; May 8-11; Scottsdale, AZ, USA. USA: IEEE. p. 218-233.
Facebook
Google+
Twitter
LinkedIn
Mendeley
StumbleUpon
CiteULike
Reddit
Email