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Tecnol. Metal. Mater. Min., vol.11 n4, 277-286, 2014 CORRELATION BETWEEN MICROSTRUCTURE AND MECHANICAL AND CORROSION RESISTANCES OF A LEAD-FREE Sn-0,7%Cu SOLDER ALLOY Spinelli, J. E.; Cheung, Noé; Osório, Wislei Riuper Ramos; Freitas, Emmanuelle Sá; Garcia, Amauri Sn-Cu alloy, Solidification, Mechanical properties, Corrosion Original Article

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Tecnol. Metal. Mater. Min., vol.11 n4, 304-310, 2014 SILICON REFINING BY VACUUM TREATMENT Lotto, André Alexandrino; Ferreira Neto, João Batista; Mourão, Marcelo Breda Purification, Silicon, Vacuum, Phosphorus Original Article

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